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| thermal and power management of integrated circuits: Thermal and Power Management of Integrated Circuits Arman Vassighi, Manoj Sachdev, 2006-06-01 In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book. |
| thermal and power management of integrated circuits: Thermal and Power Management of Integrated Circuits Arman Vassighi, Manoj Sachdev, 2008-11-01 In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book. |
| thermal and power management of integrated circuits: Heat Management in Integrated Circuits Seda Ogrenci-Memik, 2015-12 Heat Management in Integrated Circuits focuses on devices and materials that are intimately integrated on-chip (as opposed to in package or on-board) for the purposes of thermal monitoring and thermal management, i.e., cooling. The devices and circuits cover various designs used for the purpose of converting temperature to a digital measurement, heat to electricity, and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. The book includes fundamental operating principles that touch upon physics of materials that are used to construct sensing, harvesting, and cooling devices, which will be followed by circuit and system design aspects that enable successful functioning of these devices as an on-chip system. Finally, the author discusses the use of these devices and systems for thermal management and the role they play in enabling energy-efficient and sustainable high performance computing systems. |
| thermal and power management of integrated circuits: Design of Power Management Integrated Circuits Bernhard Wicht, 2024-07-22 Comprehensive resource on power management ICs affording new levels of functionality and applications with cost reduction in various fields Design of Power Management Integrated Circuits is a comprehensive reference for power management IC design, covering the circuit design of main power management circuits like linear and switched-mode voltage regulators, along with sub-circuits such as power switches, gate drivers and their supply, level shifters, the error amplifier, current sensing, and control loop design. Circuits for protection and diagnostics, as well as aspects of the physical design like lateral and vertical power delivery, pin-out, floor planning, grounding/supply guidelines, and packaging, are also addressed. A full chapter is dedicated to the design of integrated passives. The text illustrates the application of power management integrated circuits (PMIC) to growth areas like computing, the internet of Things, mobility, and renewable energy. Includes numerous real-world examples, case studies, and exercises illustrating key design concepts and techniques. Offering a unique insight into this rapidly evolving technology through the author's experience developing PMICs in both the industrial and academic environment, Design of Power Management Integrated Circuits includes information on: Capacitive, inductive and hybrid DC-DC converters and their essential circuit blocks, covering error amplifiers, comparators, and ramp generators Sensing, protection, and diagnostics, covering thermal protection, inductive loads and clamping structures, under-voltage, reference and power-on reset generation Integrated MOS, MOM and MIM capacitors, integrated inductors Control loop design and PWM generation ensuring stability and fast transient response; subharmonic oscillations in current mode control (analysis and circuit design for slope compensation) DC behavior and DC-related circuit design, covering power efficiency, line and load regulation, error amplifier, dropout, and power transistor sizing Commonly used level shifters (including sizing rules) and cascaded (tapered) driver sizing and optimization guidelines Optimizing the physical design considering packaging, floor planning, EMI, pinout, PCB design and thermal design Design of Power Management Integrated Circuits is an essential resource on the subject for circuit designers/IC designers, system engineers, and application engineers, along with advanced undergraduate students and graduate students in related programs of study. |
| thermal and power management of integrated circuits: Three-Dimensional Integrated Circuit Design Vasilis F. Pavlidis, Ioannis Savidis, Eby G. Friedman, 2017-07-04 Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization |
| thermal and power management of integrated circuits: Power Management Integrated Circuits Amit Patra, Shailendra Baranwal, Ashis Maity, Samiran Dam, Syed Asif Eqbal, 2024-09-09 This book intends to be a comprehensive text on the topic of integrated circuits for power management, putting together both theoretical foundations and practical details, leading to successful design practices in research and industry. It covers all the three main categories of power management circuits, viz., linear regulators, inductor-based switchers and switched-capacitor circuits, and presents detailed discussion of their common topologies, operation and modeling. Features Includes underlying theory and design/implementation practical ingredients for power management integrated circuits (PMICs). Provides in-depth analysis of topologies and circuits related to linear regulators, switched-capacitor converters and inductor-based converters. Covers all the relevant topics at the intersection between power electronics and integrated circuit design areas. Provides guidelines for design of circuits and solutions for all the pertinent topologies. Indicates all important issues and the related trade-offs in the design of PMICs. The book will be a valuable resource for senior- and graduate-level students as well as industry professionals who have done university-level courses on analog circuit design, control systems and power electronics. |
| thermal and power management of integrated circuits: Three-Dimensional Integrated Circuit Design Yuan Xie, Jingsheng Jason Cong, Sachin Sapatnekar, 2009-12-02 We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs). |
| thermal and power management of integrated circuits: Power Management Integrated Circuits Mona M. Hella, Patrick Mercier, 2017-12-19 Power Management Integrated Circuits and Technologies delivers a modern treatise on mixed-signal integrated circuit design for power management. Comprised of chapters authored by leading researchers from industry and academia, this definitive text: Describes circuit- and architectural-level innovations that meet advanced power and speed capabilities Explores hybrid inductive-capacitive converters for wide-range dynamic voltage scaling Presents innovative control techniques for single inductor dual output (SIDO) and single inductor multiple output (SIMO) converters Discusses cutting-edge design techniques including switching converters for analog/RF loads Compares the use of GaAs pHEMTs to CMOS devices for efficient high-frequency switching converters Thus, Power Management Integrated Circuits and Technologies provides comprehensive, state-of-the-art coverage of this exciting and emerging field of engineering. |
| thermal and power management of integrated circuits: Adaptive Cooling of Integrated Circuits Using Digital Microfluidics Philip Y. Paik, Krishnendu Chakrabarty, Vamsee K. Pamula, 2007 Thanks to increasing power consumption and component density, localized hot spots are becoming a serious challenge in IC (integrated circuit) chip design - so serious, in fact, that Intel recently had to yank a circuit because it was literally burning. For IC engineers grappling with high power dissipation and thermal issues, new droplet-based cooling techniques using digital microfluidics technology could provide the solution. This definitive guide paves the way, with design and implementation methodologies and prototypes for utilizing this groundbreaking technology. After reviewing cooling principles and current bulk cooling methods, the book brings engineers up to speed on emerging droplet-based architectures. Amply illustrated, this milestone work will prove invaluable in tackling IC heat issues that existing methods can no longer address. |
| thermal and power management of integrated circuits: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits Sung Kyu Lim, 2012-11-27 This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process. |
| thermal and power management of integrated circuits: Thermal and Power Management of Integrated Circuits Arman Vassighi, Manoj Sachdev, 2008-11-01 In Thermal and Power Management of Integrated Circuits, power and thermal management issues in integrated circuits during normal operating conditions and stress operating conditions are addressed. Thermal management in VLSI circuits is becoming an integral part of the design, test, and manufacturing. Proper thermal management is the key to achieve high performance, quality and reliability. Performance and reliability of integrated circuits are strong functions of the junction temperature. A small increase in junction temperature may result in significant reduction in the device lifetime. This book reviews the significance of the junction temperature as a reliability measure under nominal and burn-in conditions. The latest research in the area of electro-thermal modeling of integrated circuits will also be presented. Recent models and associated CAD tools are covered and various techniques at the circuit and system levels are reviewed. Subsequently, the authors provide an insight into the concept of thermal runaway and how it may best be avoided. A section on low temperature operation of integrated circuits concludes the book. |
| thermal and power management of integrated circuits: Power Electronic Packaging Yong Liu, 2012-02-15 Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions. |
| thermal and power management of integrated circuits: GaN Transistors for Efficient Power Conversion Alex Lidow, Michael de Rooij, Johan Strydom, David Reusch, John Glaser, 2019-09-30 An up-to-date, practical guide on upgrading from silicon to GaN, and how to use GaN transistors in power conversion systems design This updated, third edition of a popular book on GaN transistors for efficient power conversion has been substantially expanded to keep students and practicing power conversion engineers ahead of the learning curve in GaN technology advancements. Acknowledging that GaN transistors are not one-to-one replacements for the current MOSFET technology, this book serves as a practical guide for understanding basic GaN transistor construction, characteristics, and applications. Included are discussions on the fundamental physics of these power semiconductors, layout, and other circuit design considerations, as well as specific application examples demonstrating design techniques when employing GaN devices. GaN Transistors for Efficient Power Conversion, 3rd Edition brings key updates to the chapters of Driving GaN Transistors; Modeling, Simulation, and Measurement of GaN Transistors; DC-DC Power Conversion; Envelope Tracking; and Highly Resonant Wireless Energy Transfer. It also offers new chapters on Thermal Management, Multilevel Converters, and Lidar, and revises many others throughout. Written by leaders in the power semiconductor field and industry pioneers in GaN power transistor technology and applications Updated with 35% new material, including three new chapters on Thermal Management, Multilevel Converters, Wireless Power, and Lidar Features practical guidance on formulating specific circuit designs when constructing power conversion systems using GaN transistors A valuable resource for professional engineers, systems designers, and electrical engineering students who need to fully understand the state-of-the-art GaN Transistors for Efficient Power Conversion, 3rd Edition is an essential learning tool and reference guide that enables power conversion engineers to design energy-efficient, smaller, and more cost-effective products using GaN transistors. |
| thermal and power management of integrated circuits: Advances In 3d Integrated Circuits And Systems Hao Yu, Chuan Seng Tan, 2015-08-28 3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems. |
| thermal and power management of integrated circuits: Design of 3D Integrated Circuits and Systems Rohit Sharma, 2018-09-03 Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems. |
| thermal and power management of integrated circuits: Interdisciplinary Design: Proceedings of the 21st CIRP Design Conference , |
| thermal and power management of integrated circuits: Integrated Power Devices and TCAD Simulation Yue Fu, Zhanming Li, Wai Tung Ng, Johnny K.O. Sin, 2017-12-19 From power electronics to power integrated circuits (PICs), smart power technologies, devices, and beyond, Integrated Power Devices and TCAD Simulation provides a complete picture of the power management and semiconductor industry. An essential reference for power device engineering students and professionals, the book not only describes the physics inside integrated power semiconductor devices such lateral double-diffused metal oxide semiconductor field-effect transistors (LDMOSFETs), lateral insulated-gate bipolar transistors (LIGBTs), and super junction LDMOSFETs but also delivers a simple introduction to power management systems. Instead of abstract theoretical treatments and daunting equations, the text uses technology computer-aided design (TCAD) simulation examples to explain the design of integrated power semiconductor devices. It also explores next generation power devices such as gallium nitride power high electron mobility transistors (GaN power HEMTs). Including a virtual process flow for smart PIC technology as well as a hard-to-find technology development organization chart, Integrated Power Devices and TCAD Simulation gives students and junior engineers a head start in the field of power semiconductor devices while helping to fill the gap between power device engineering and power management systems. |
| thermal and power management of integrated circuits: Handbook of 3D Integration, Volume 4 Paul D. Franzon, Erik Jan Marinissen, Muhannad S. Bakir, 2019-01-25 This fourth volume of the landmark handbook focuses on the design, testing, and thermal management of 3D-integrated circuits, both from a technological and materials science perspective. Edited and authored by key contributors from top research institutions and high-tech companies, the first part of the book provides an overview of the latest developments in 3D chip design, including challenges and opportunities. The second part focuses on the test methods used to assess the quality and reliability of the 3D-integrated circuits, while the third and final part deals with thermal management and advanced cooling technologies and their integration. |
| thermal and power management of integrated circuits: Enabling the Internet of Things Massimo Alioto, 2017-01-23 This book offers the first comprehensive view on integrated circuit and system design for the Internet of Things (IoT), and in particular for the tiny nodes at its edge. The authors provide a fresh perspective on how the IoT will evolve based on recent and foreseeable trends in the semiconductor industry, highlighting the key challenges, as well as the opportunities for circuit and system innovation to address them. This book describes what the IoT really means from the design point of view, and how the constraints imposed by applications translate into integrated circuit requirements and design guidelines. Chapter contributions equally come from industry and academia. After providing a system perspective on IoT nodes, this book focuses on state-of-the-art design techniques for IoT applications, encompassing the fundamental sub-systems encountered in Systems on Chip for IoT: ultra-low power digital architectures and circuits low- and zero-leakage memories (including emerging technologies) circuits for hardware security and authentication System on Chip design methodologies on-chip power management and energy harvesting ultra-low power analog interfaces and analog-digital conversion short-range radios miniaturized battery technologies packaging and assembly of IoT integrated systems (on silicon and non-silicon substrates). As a common thread, all chapters conclude with a prospective view on the foreseeable evolution of the related technologies for IoT. The concepts developed throughout the book are exemplified by two IoT node system demonstrations from industry. The unique balance between breadth and depth of this book: enables expert readers quickly to develop an understanding of the specific challenges and state-of-the-art solutions for IoT, as well as their evolution in the foreseeable future provides non-experts with a comprehensive introduction to integrated circuit design for IoT, and serves as an excellent starting point for further learning, thanks to the broad coverage of topics and selected references makes it very well suited for practicing engineers and scientists working in the hardware and chip design for IoT, and as textbook for senior undergraduate, graduate and postgraduate students ( familiar with analog and digital circuits). |
| thermal and power management of integrated circuits: Heat Management in Integrated Circuits Seda Ogrenci-Memik, 2015 As integrated circuits get smaller and more complex, power densities are increasing, leading to more heat generation. Dealing with this heat is fast becoming the most important design bottleneck of current and future integrated circuits, where power envelopes are defined by the ability of the system to dissipate the generated heat. Thermal effects are forcing chip designers to apply conservative design margins, creating sub-optimal results. At a larger scale, cooling is the second most costly item in the electricity bills of well-designed high-performance computing and data centers, costing 30-50% of the total. Thermal monitoring and management in integrated circuits is therefore becoming increasingly important. This book covers thermal monitoring and management in integrated circuits, with a focus on devices and materials that are intimately integrated on-chip as opposed to in-package or on-board. The devices and circuits discussed include various designs used for the purpose of converting temperature to a digital measurement and actively biased circuits that reverse thermal gradients on chips for the purpose of cooling. Topics covered include an overview of heat in integrated circuits and systems, on-chip temperature sensing, dynamic thermal management, active cooling, and mitigating thermal events at the system-level and above--Provided by publisher. |
| thermal and power management of integrated circuits: MICAI 2008: Advances in Artificial Intelligence Alexander Gelbukh, Eduardo F. Morales, 2008-10-17 The Mexican International Conference on Artificial Intelligence (MICAI), a yearly international conference series organized by the Mexican Society for Artificial Intel- gence (SMIA), is a major international AI forum and the main event in the academic life of the country’s growing AI community. In 2008 Mexico celebrates the 50th an- versary of development of computer science in the country: in 1958 the first computer was installed at the National Autonomous University of Mexico (UNAM). Nowadays, computer science is the country’s fastest growing research area. The proceedings of the previous MICAI events were published by Springer in its Lecture Notes in Artificial Intelligence (LNAI) series, vol. 1793, 2313, 2972, 3789, 4293, and 4827. Since its foundation in 2000, the conference has been growing in popularity, and improving in quality. This volume contains the papers presented at the oral session of the 7th Mexican International Conference on Artificial Intelligence, MICAI 2008, held October 27–31, 2008, in Atizapán de Zaragoza, Mexico. The conference received for evaluation 363 submissions by 1,032 authors from 43 countries (see Tables 1 and 2). This volume contains revised versions of 94 papers by 308 authors from 28 countries selected - cording to the results of an international reviewing process. Thus the acceptance rate was 25.9%. The book is structured into 20 thematic fields representative of the main current areas of interest for the AI community, plus a section of invited papers: |
| thermal and power management of integrated circuits: The Unseen World Beneath Our Devices Barrett Williams, ChatGPT, 2024-11-29 Dive into the mesmerizing world that invisibly powers our modern lives with The Unseen World Beneath Our Devices. This eBook is your comprehensive guide into the heart of integrated circuits—the unsung heroes behind every piece of technology we use today. From smartphones to smart cars, these tiny marvels are the backbone of our digital era, and this book reveals their secrets like never before. Embark on an enlightening journey starting with the fascinating evolution of electronics and the revolutionary birth of integrated circuits. Explore how microchips were forged in the minds of pioneering inventors and understand the fundamental components that make up the circuits themselves. Dive deep into the physics of semiconductors and uncover the processes behind the creation and miniaturization of chips. Discover the intricate steps involved in chip making, from silicon wafers and photolithography to cutting-edge etching techniques. Delve into the world of power management and learn how energy efficiency is critical in today's fast-paced tech scene. Uncover the advanced packaging and interconnect technologies that enable our devices to be faster and more reliable. Beyond the technological, this eBook examines the societal impacts of integrated circuits, touching on the profound economic and environmental implications. It tackles pressing ethical considerations, such as data privacy and global competition, making it a well-rounded exploration of this essential field. For those eager to get hands-on, there's guidance on how to start building your own circuits and insights into career paths in integrated circuit design. Whether you're a tech enthusiast or a budding engineer, this eBook opens up a world of endless possibility, innovation, and inspiration—a testament to the invisible yet indispensable world beneath our devices. Uncover the future of technology today and be part of the narrative shaping tomorrow. |
| thermal and power management of integrated circuits: Integrated Microsystems Krzysztof Iniewski, 2017-12-19 As rapid technological developments occur in electronics, photonics, mechanics, chemistry, and biology, the demand for portable, lightweight integrated microsystems is relentless. These devices are getting exponentially smaller, increasingly used in everything from video games, hearing aids, and pacemakers to more intricate biomedical engineering and military applications. Edited by Kris Iniewski, a revolutionary in the field of advanced semiconductor materials, Integrated Microsystems: Electronics, Photonics, and Biotechnology focuses on techniques for optimized design and fabrication of these intelligent miniaturized devices and systems. Composed of contributions from experts in academia and industry around the world, this reference covers processes compatible with CMOS integrated circuits, which combine computation, communications, sensing, and actuation capabilities. Light on math and physics, with a greater emphasis on microsystem design and configuration and electrical engineering, this book is organized in three sections—Microelectronics and Biosystems, Photonics and Imaging, and Biotechnology and MEMs. It addresses key topics, including physical and chemical sensing, imaging, smart actuation, and data fusion and management. Using tables, figures, and equations to help illustrate concepts, contributors examine and explain the potential of emerging applications for areas including biology, nanotechnology, micro-electromechanical systems (MEMS), microfluidics, and photonics. |
| thermal and power management of integrated circuits: Antenna-in-Package Technology and Applications Duixian Liu, Yueping Zhang, 2020-03-31 A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging. |
| thermal and power management of integrated circuits: Trends in Network and Communications David C. Wyld, Michal Wozniak, Nabendu Chaki, Natarajan Meghanathan, Dhinaharan Nagamalai, 2011-06-30 This book constitutes the proceedings of three International Conferences, NeCoM 2011, on Networks & Communications, WeST 2011, on Web and Semantic Technology, and WiMoN 2011, on Wireless and Mobile Networks, jointly held in Chennai, India, in July 2011. The 74 revised full papers presented were carefully reviewed and selected from numerous submissions. The papers address all technical and practical aspects of networks and communications in wireless and mobile networks dealing with issues such as network protocols and wireless networks, data communication technologies, and network security; they present knowledge and results in theory, methodology and applications of the Web and semantic technologies; as well as current research on wireless and mobile communications, networks, protocols and on wireless and mobile security. |
| thermal and power management of integrated circuits: Design and Test Technology for Dependable Systems-on-Chip Ubar, Raimund, Raik, Jaan, Vierhaus, Heinrich Theodor, 2010-12-31 This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)-- |
| thermal and power management of integrated circuits: Energy Efficient Servers Corey Gough, Ian Steiner, Winston Saunders, 2015-04-07 Energy Efficient Servers: Blueprints for Data Center Optimization introduces engineers and IT professionals to the power management technologies and techniques used in energy efficient servers. The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers. |
| thermal and power management of integrated circuits: Direct Copper Interconnection for Advanced Semiconductor Technology Dongkai Shangguan, 2024-06-28 In the “More than Moore” era, performance requirements for leading edge semiconductor devices are demanding extremely fine pitch interconnection in semiconductor packaging. Direct copper interconnection has emerged as the technology of choice in the semiconductor industry for fine pitch interconnection, with significant benefits for interconnect density and device performance. Low-temperature direct copper bonding, in particular, will become widely adopted for a broad range of highperformance semiconductor devices in the years to come. This book offers a comprehensive review and in-depth discussions of the key topics in this critical new technology. Chapter 1 reviews the evolution and the most recent advances in semiconductor packaging, leading to the requirement for extremely fine pitch interconnection, and Chapter 2 reviews different technologies for direct copper interconnection, with advantages and disadvantages for various applications. Chapter 3 offers an in-depth review of the hybrid bonding technology, outlining the critical processes and solutions. The area of materials for hybrid bonding is covered in Chapter 4, followed by several chapters that are focused on critical process steps and equipment for copper electrodeposition (Chapter 5), planarization (Chapter 6), wafer bonding (Chapter 7), and die bonding (Chapter 8). Aspects related to product applications are covered in Chapter 9 for design and Chapter 10 for thermal simulation. Finally, Chapter 11 covers reliability considerations and computer modeling for process and performance characterization, followed by the final chapter (Chapter 12) outlining the current and future applications of the hybrid bonding technology. Metrology and testing are also addressed throughout the chapters. Business, economic, and supply chain considerations are discussed as related to the product applications and manufacturing deployment of the technology, and the current status and future outlook as related to the various aspects of the ecosystem are outlined in the relevant chapters of the book. The book is aimed at academic and industry researchers as well as industry practitioners, and is intended to serve as a comprehensive source of the most up-to-date knowledge, and a review of the state-of-the art of the technology and applications, for direct copper interconnection and advanced semiconductor packaging in general. |
| thermal and power management of integrated circuits: Basics of Circuit Design cybellium, 2024-10-26 Designed for professionals, students, and enthusiasts alike, our comprehensive books empower you to stay ahead in a rapidly evolving digital world. * Expert Insights: Our books provide deep, actionable insights that bridge the gap between theory and practical application. * Up-to-Date Content: Stay current with the latest advancements, trends, and best practices in IT, Al, Cybersecurity, Business, Economics and Science. Each guide is regularly updated to reflect the newest developments and challenges. * Comprehensive Coverage: Whether you're a beginner or an advanced learner, Cybellium books cover a wide range of topics, from foundational principles to specialized knowledge, tailored to your level of expertise. Become part of a global network of learners and professionals who trust Cybellium to guide their educational journey. www.cybellium.com |
| thermal and power management of integrated circuits: RF and Microwave Microelectronics Packaging II Ken Kuang, Rick Sturdivant, 2017-03-09 This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to “RF and Microwave Microelectronics Packaging” (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics. |
| thermal and power management of integrated circuits: Power Management in Mobile Devices Findlay Shearer, 2011-04-01 Sealed Lead Acid...Nickel Cadmium...Lithium Ion...How do you balance battery life with performance and cost?This book shows you how!Now that mobile has become the standard, the consumer not only expects mobility but demands power longevity in wireless devices. As more and more features, computing power, and memory are packed into mobile devices such as iPods, cell phones, and cameras, there is a large and growing gap between what devices can do and the amount of energy engineers can deliver. In fact, the main limiting factor in many portable designs is not hardware or software, but instead how much power can be delivered to the device. This book describes various design approaches to reduce the amount of power a circuit consumes and techniques to effectively manage the available power.Power Management Advice On:•Low Power Packaging Techniques•Power and Clock Gating•Energy Efficient Compilers•Various Display Technologies•Linear vs. Switched Regulators•Software Techniques and Intelligent Algorithms* Addresses power versus performance that each newly developed mobile device faces* Robust case studies drawn from the author's 30 plus years of extensive real world experience are included* Both hardware and software are discussed concerning their roles in power |
| thermal and power management of integrated circuits: Energy-Aware Systems and Networking for Sustainable Initiatives Kaabouch, Naima, Hu, Wen-Chen, 2012-06-30 This book covers a great variety of topics such as materials, environment, electronics, and computing, offering a vital source of information detailing the latest architectures, frameworks, methodologies, and research on energy-aware systems and networking for sustainable initiatives-- |
| thermal and power management of integrated circuits: 3D Microelectronic Packaging Yan Li, Deepak Goyal, 2017-01-20 This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development. |
| thermal and power management of integrated circuits: RF and Microwave Circuits, Measurements, and Modeling Mike Golio, Janet Golio, 2018-10-08 Highlighting the challenges RF and microwave circuit designers face in their day-to-day tasks, RF and Microwave Circuits, Measurements, and Modeling explores RF and microwave circuit designs in terms of performance and critical design specifications. The book discusses transmitters and receivers first in terms of functional circuit block and then examines each block individually. Separate articles consider fundamental amplifier issues, low noise amplifiers, power amplifiers for handset applications and high power, power amplifiers. Additional chapters cover other circuit functions including oscillators, mixers, modulators, phase locked loops, filters and multiplexers. New chapters discuss high-power PAs, bit error rate testing, and nonlinear modeling of heterojunction bipolar transistors, while other chapters feature new and updated material that reflects recent progress in such areas as high-volume testing, transmitters and receivers, and CAD tools. The unique behavior and requirements associated with RF and microwave systems establishes a need for unique and complex models and simulation tools. The required toolset for a microwave circuit designer includes unique device models, both 2D and 3D electromagnetic simulators, as well as frequency domain based small signal and large signal circuit and system simulators. This unique suite of tools requires a design procedure that is also distinctive. This book examines not only the distinct design tools of the microwave circuit designer, but also the design procedures that must be followed to use them effectively. |
| thermal and power management of integrated circuits: Advanced Circuits for Emerging Technologies Krzysztof Iniewski, 2012-04-17 The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors. |
| thermal and power management of integrated circuits: Energy Efficient Servers Corey Gough, Ian Steiner, Winston Saunders, 2015-03-28 Energy Efficient Servers: Blueprints for Data Center Optimization introduces engineers and IT professionals to the power management technologies and techniques used in energy efficient servers. The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers. |
| thermal and power management of integrated circuits: Power Systems-On-Chip Bruno Allard, 2016-11-22 The book gathers the major issues involved in the practical design of Power Management solutions in wireless products as Internet-of-things. Presentation is not about state-of-the-art but about appropriation of validated recent technologies by practicing engineers. The book delivers insights on major trade-offs and a presentation of examples as a cookbook. The content is segmented in chapters to make access easier for the lay-person. |
| thermal and power management of integrated circuits: Fundamentals of Electromigration-Aware Integrated Circuit Design Jens Lienig, Susann Rothe, Matthias Thiele, 2025-02-25 The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. This second edition has been updated to introduce recent advancements in the understanding of the physical process of electromigration, which gives the reader the knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration’s negative impact on circuit reliability. |
| thermal and power management of integrated circuits: Heat Transfer Younes Shabany, 2009-12-17 The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use |
| thermal and power management of integrated circuits: Managing Electric Vehicle Power Sam Davis, 2020-08-31 Power management involves all the power consumed in an electric vehicle (EV), so it impacts the vehicle's performance, safety, and driving range. To provide these vehicle characteristics, power management: Ensures that the proper power, voltage, and current are applied to each electronic circuit. Ensures that there is isolation between low-voltage and highvoltage (HV) circuits. Offers power circuit protection against electrical disturbances that can affect internal or external circuits. Managing Electric Vehicle Power provides complete coverage for understanding how best to utilize the primary power source across all the EV's Electric Control Units. Readers will also be introduced to the qualification standards of the Automotive Electronics Council (AEC). AEC standards are a 'one-time' qualification that typically takes place at the end of the development cycle. |
THERMAL Definition & Meaning - Merriam-Webster
The meaning of THERMAL is of, relating to, or caused by heat. How to use thermal in a sentence. Did you know?
THERMAL | definition in the Cambridge English Dictionary
THERMAL meaning: 1. connected with heat: 2. (of clothes or coverings) made of a material that is especially…. Learn more.
Thermal - Wikipedia
A thermal column (or thermal) is a rising mass of buoyant air, a convective current in the atmosphere, that transfers heat energy vertically. [1] . Thermals are created by the uneven …
Why New York Is All-In on Thermal Energy Networks
May 16, 2025 · In 2022, Governor Hochul signed the Utility Thermal Energy Network and Jobs Act, laying the foundation for projects from New York City to Buffalo. Since then, she’s …
New York Approves Landmark Thermal Network Legislation
On July 5, 2022, Governor Kathy Hochul signed NY Senate Bill S9422 into law, which "establishes the Utility Thermal Energy Network and Jobs Act to promote the development of …
Large-Scale Thermal - NYSERDA
Just a few feet beneath the earth’s surface the underground temperature is a steady at around 54°F throughout the year. Large-scale thermal systems, which use ground source heat pumps …
Advanced Fuels & Thermal Energy Storage - NYSERDA
Developers of new technologies for the use of clean fuels find technical assistance and commercialization support in NYSERDA’s Advanced Fuels & Thermal Energy Storage …
Thermal Energy Networks - Con Edison
Thermal energy networks connect multiple buildings through a loop of underground pipes carrying a water-based fluid. The fluid maintains a constant temperature by exchanging heat with the …
Thermal Energy Networks - NYSERDA
A thermal energy network uses a network of pipes to connect multiple buildings together, often including a large anchor off-taker (e.g., college/university, hospital), and to thermal sources …
About Thermal Energy Networks — Upgrade NY
Thermal Energy Networks are utility-scale infrastructure projects that connect multiple buildings into a shared network with sources of thermal energy like geothermal boreholes, surface …
THERMAL Definition & Meaning - Merriam-Webster
The meaning of THERMAL is of, relating to, or caused by heat. How to use thermal in a sentence. Did you know?
THERMAL | definition in the Cambridge English Dictionary
THERMAL meaning: 1. connected with heat: 2. (of clothes or coverings) made of a material that is especially…. Learn more.
Thermal - Wikipedia
A thermal column (or thermal) is a rising mass of buoyant air, a convective current in the atmosphere, that transfers heat energy …
Why New York Is All-In on Thermal Energy Networks
May 16, 2025 · In 2022, Governor Hochul signed the Utility Thermal Energy Network and Jobs Act, laying the foundation for …
New York Approves Landmark Thermal Network Legislation
On July 5, 2022, Governor Kathy Hochul signed NY Senate Bill S9422 into law, which "establishes the Utility Thermal Energy …
